Thermal comfort badge

Get data from Forrest’s thermal comfort badge designed for the ACEE World Economic Forum YGL events in July 2018 at the Andlinger Center. Now being used to do more “research” on the comfort conditions at international conferences


-Particle Photon for cloud data publishing
-Python script and Mongo database for storage
-DHT22 for temp/humid
-Melexis 90614 non-contacting IR surface temp sensor
-Phone backup battery
-Laser cut acrylic case
-Custom printed PCB

Research team led by Prof Forrest Meggers, faculty jointly appointed in the School of Architecture and the Andlinger Center for Energy and the Environment.